ДиодМодуль - Энергоэффективность за счет инноваций

semi_chip2GeneSiC является пионером и мировым лидером в области технологии карбида кремния, а также инвестировал в мощные кремниевые технологии. The global leading manufacturers of industrial and defense systems depend on GeneSiC’s technology to elevate the performance and efficiency of their products.

GeneSiC технологии играют ключевую роль в экономии энергии в широком спектре систем большой мощности.. Наша технология позволяет эффективно использовать возобновляемые источники энергии..

GeneSiC электронные компоненты работают холоднее, Быстрее, и более экономично. У нас есть ведущие патенты на технологии широкополосных устройств питания.; рынок, который, по прогнозам, достигнет $1 миллиард по 2022.

Our core competency is to add more value to our customersend product. Our performance and cost metrics are setting standards in the Silicon Carbide industry.

If you are interested in contacting GeneSiC concerning investor relations, please send an email toinvestors@genesicsemi.com

President

Dr. Ranbir Singh founded GeneSiC Semiconductor Inc. in 2004. Prior to that he conducted research on SiC power devices first at Cree Inc, and then at the NIST, Gaithersburg, MD. He has developed critical understanding and published on a wide range of SiC power devices including PiN, JBS and Schottky diodes, MOSFETs, IGBTs, Thyristors and field controlled thyristors. He received his Ph.D. and MS degrees in Electrical and Computer Engineering, from North Carolina State University, Raleigh, NC, and B. Tech from Indian Institute of Technology, Delhi. В 2012, EE Times named Dr. Singh as among "Forty Innovators building the foundations of next generation electronics industry." В 2011, he won the R&D100 award towards his efforts in commercializing 6.5kV SiC Thyristors. He has published over 200 journal and conference papers, is an author on over 30 issued US patents, and has authored a book.

Vice-President of Technology

Dr. Siddarth Sundaresan is GeneSiC's Vice-President of Technology. He received his M.S. and Ph.D. degrees in Electrical Engineering from George Mason University in 2004 и 2007, respectively. Dr. Sundaresan has published more than 65 technical articles and conference proceedings on device, materials and processing aspects of power devices fabricated on SiC and GaN. He has served on the technical program committee of the International Conference on SiC and Related Materials (ICSCRM) and is a current technical committee member for the International Symposium on Power Semiconductor Devices and ICs (ISPSD).

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