ديود - كفاءة الطاقة من خلال الابتكار

semi_chip2جينسيك هي شركة رائدة ورائدة عالميًا في مجال تكنولوجيا كربيد السيليكون, بينما استثمرت أيضًا في تقنيات السيليكون عالية الطاقة. The global leading manufacturers of industrial and defense systems depend on GeneSiC’s technology to elevate the performance and efficiency of their products.

جينسيك تلعب التكنولوجيا دورًا رئيسيًا في الحفاظ على الطاقة في مجموعة واسعة من الأنظمة عالية الطاقة. تتيح تقنيتنا الحصاد الفعال لمصادر الطاقة المتجددة.

جينسيك المكونات الإلكترونية تعمل برودة, بسرعة, وأكثر اقتصادا. نحمل براءات اختراع رائدة في تقنيات أجهزة الطاقة ذات فجوة واسعة; سوق من المتوقع أن تصل $1 مليار بواسطة 2022.

Our core competency is to add more value to our customersend product. Our performance and cost metrics are setting standards in the Silicon Carbide industry.

If you are interested in contacting GeneSiC concerning investor relations, please send an email toinvestors@genesicsemi.com

President

Dr. Ranbir Singh founded GeneSiC Semiconductor Inc. in 2004. Prior to that he conducted research on SiC power devices first at Cree Inc, and then at the NIST, Gaithersburg, MD. He has developed critical understanding and published on a wide range of SiC power devices including PiN, JBS and Schottky diodes, MOSFETs, IGBTs, Thyristors and field controlled thyristors. He received his Ph.D. and MS degrees in Electrical and Computer Engineering, from North Carolina State University, Raleigh, NC, and B. Tech from Indian Institute of Technology, Delhi. في 2012, EE Times named Dr. Singh as among "Forty Innovators building the foundations of next generation electronics industry." في 2011, he won the R&D100 award towards his efforts in commercializing 6.5kV SiC Thyristors. He has published over 200 journal and conference papers, is an author on over 30 issued US patents, and has authored a book.

Vice-President of Technology

Dr. Siddarth Sundaresan is GeneSiC's Vice-President of Technology. He received his M.S. and Ph.D. degrees in Electrical Engineering from George Mason University in 2004 و 2007, respectively. Dr. Sundaresan has published more than 65 technical articles and conference proceedings on device, materials and processing aspects of power devices fabricated on SiC and GaN. He has served on the technical program committee of the International Conference on SiC and Related Materials (ICSCRM) and is a current technical committee member for the International Symposium on Power Semiconductor Devices and ICs (ISPSD).

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